Standards & Documents Search

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Title	Document #	Date
Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.	MS-030-A
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Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.	MS-033-A
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Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.	MS-034G	Jan 2017
Item No. 11.11-933 (S) Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages. Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.	MS-028-C
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Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.	MS-005-A
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Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH.	MS-003-A
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Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.	MS-002-A
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Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237.	MS-004-B
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Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.	MS-006-A
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Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.	MS-008-A
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Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH.	MS-007-A
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Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.	MS-009-A
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PLASTIC DUAL SMALL OUTLINE, 1.27 MM PITCH, 7.50 MM BODY WIDTH, RECT FAMILY PACKAGE	MS-013H	Feb 2025
Designator: PDSO-G#-I1p27... Item 11-1062 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE GULL WING, 1.27 MM PITCH PACKAGE	MS-012H	Feb 2025
Designator: PDSO-G#_I127-##... Item 11-1061 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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JEDEC Education Series: Memory, Mobile & Modules