Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S. |
MS-022-B | |
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Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S |
MS-025-B | |
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Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A. |
MS-006-A | |
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Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S |
MS-027-A | |
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Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S |
MS-029-A | |
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Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s. |
MS-028-C | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S. |
MS-031-A | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S. |
MS-030-A | |
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Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S. |
MS-033-A | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S. |
MS-032-A | |
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Standard - .050 inch Center Leadless Chip Carrier, Type C. Variations CA-CH. Item 11.10-237. |
MS-004-B | |
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Standard - Dual-In-Line Plastic Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-271S |
MS-001-D | |
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Standard - .050 inch Leadless Chip Carrier, Type B. Variation BA-BH. |
MS-003-A | |
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Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S. |
MS-021-A | |
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