Standards & Documents Search

Displaying 21 - 34 of 34 documents. Show 5 | 10 | 20 results per page.

Title	Document #	Date
Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.	MS-022-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S	MS-025-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.	MS-032-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S	MS-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S	MS-029-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.	MS-028-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.	MS-031-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.	MS-030-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.	MS-033-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.	MS-026-D	Jan 2001
Clarification to note 15 of the Low Profile PQFP registration MS-026 as issue D. Item 11.11-577s Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)	MS-024H	Jun 2006
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.	MS-034G	Jan 2017
Item No. 11.11-933 (S) Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages. Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package	MS-012G.02	Sep 2020
Designator: PDSO-G#_I127-##... Item 11.11-972(E), Minor editorial correction. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family	MS-013G	Oct 2020
Designator: PDSO-G#-I1p27... Item 11.11-967(S). Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.

Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S

Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.

Standard - Small Outline J-Lead (SOJ) Family, .400 inch Wide Body. PDSO-J. Item 11.11-404S

Standard - Fine Pitch Plastic Quad Flat Package Outline 2.6 mm Footprint. Item 11.11-484S

Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.

Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.

Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S.

Standard - Ceramic Dual Flatpack (CerPak) Package Family, .050 inch Pitch. Item 11.10-382S.

Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.

Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S)

Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.

Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package

Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family

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