Global Standards for the Microelectronics Industry
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| Title | Document # |
Date |
|---|---|---|
Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S) |
MS-024H | Jun 2006 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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