Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
---|---|---|
Registration - 2, 4, and 6 Lead Screw Mount Power Package. PDFP-(C, F, G). Item 11.10-444. |
TO-272-C | Oct 2007 |
Committee(s): JC-11.11, JC-11.10 Free download. Registration or login required. |
||
Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309. |
TO-265-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 4 Lead Quad Flat Pack (QFP). |
TO-271-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 4 Lead Small Outline Package (SOP). Item 11.10-358 |
TO-269-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Addition of Variation AB to Flange-Mounted Header Family. Item 11.10-307. |
TO-259-B | |
Committee(s): JC-11 Free download. Registration or login required. |