Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - 2 and 4 Lead Surface Mount Power Package. (H,HB1)-PDSO, (H,HB1)-PSOF. Item 11.10-446. |
TO-270C | Jul 2008 |
Free download. Registration or login required. |
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Registration - 2, 4, and 6 Lead Screw Mount Power Package. PDFP-(C, F, G). Item 11.10-444. |
TO-272-C | Oct 2007 |
Committee(s): JC-11.11, JC-11.10 Free download. Registration or login required. |
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Registration - Thin profile, 3 lead, Plastic Small Outline, Surface Mount. T-PSOF-3. Item 11.10-441(E). |
TO-278B | Nov 2006 |
Patents(): STMicroelectronics Inc. Free download. Registration or login required. |
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Registration - Small Outines Plastic Surface Mount Package. T-PSON-3. Item 11.10-436 |
TO-277A | Jan 2006 |
Free download. Registration or login required. |
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Registration - Plastic Flange Mounted Package, 3 Leads (IR's Modification of 3 Lead TO-220). Item 11.10-389. Addition of patent note in drawing. R-PSIP-F3. Item 11.1-664(e), . |
TO-273-B | Jul 2003 |
Patents(): It has been stated that U.S. Patent No. 6,476,481 (held by International Rectifier) may be required to comply with certain implementations of the package outline. Committee(s): JC-11.1, JC-11.10 Free download. Registration or login required. |