Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298. |
MO-129-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TSOP I, 7.62 mm Body. Item 11.11-346. |
MO-132-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311. |
MO-139-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312. |
MO-140-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E |
MO-142-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319. |
MO-141-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP). |
MO-143-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324. |
MO-145-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320. |
MO-146-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Shrink Small Outline Package (SSOP). R-PSDO-G/SSOP. Item 11.11-440. |
MO-152-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459. |
MO-154-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Small Outline (SOP), 5-Lead. Item 11.11-364. |
MO-155-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic CGA Rectangular. Item 11.10-371. |
MO-159-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017. |
MO-160-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Flatpack/Heat Slug Package, 0.8 mm Pitch, 48 Leads. Item 11.11-370. |
MO-162-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Shrink SO Package Family, 9.9 mm Wide Body, 36 and 70 Pins R-PDSO-G . Item 11.11-331 |
MO-164-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455 |
MO-165-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic SO with Heat Slug, 20, 24, 30, 36 leads. Addition of a 44 lead (0.65 mm pitch) Plastic Heat Slug Package. Variations AA-AE. Item 11.11-551. |
MO-166-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Isolated Flange-Mounted Header Family. Variations AA-AB. Item 11.10-344. |
MO-168-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029. |
MO-167-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 88 Pin Memory Card. Item 11.14-012. |
MO-171-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010. |
MO-170-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041. |
MO-172-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403. |
MO-173-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412. |
MO-175-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401. |
MO-174-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353. |
MO-176-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021. |
MO-179-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418. |
MO-181-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454. |
MO-182-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426. |
MO-183-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548. |
MO-184-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022. |
MO-185-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E. |
MO-186-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451. |
MO-189-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Power PQFP with Heat Slug. Item 11.11-559. |
MO-188-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027. |
MO-191-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492. |
MO-194-B | |
Free download. Registration or login required. |
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Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498. |
MO-197-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508. |
MO-196-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 3-Tier Family. PQFP-B. Item 11.11-473. |
MO-198-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512. |
MO-199-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513. |
MO-200-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496. |
MO-202-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507. |
MO-209-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511. |
MO-212-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393 |
MO-218-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See MS-026-C. Item 11.11-483S. |
MO-136-A | |
Committee(s): JC-11 |
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Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch). |
MO-163-B | |
Committee(s): JC-11 |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390). |
MO-003-C | |
Committee(s): JC-11 |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392). |
MO-019-D | |
Committee(s): JC-11 |
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RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed. |
MO-101-A | |
Committee(s): JC-11 |
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RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
Committee(s): JC-11 |
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