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Title	Document #	Date
Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.	MO-255-B	Oct 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.	MO-247-D	May 2007
Item 11.11-767 Patents(): AIT, ASAT: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.	MO-236C	Mar 2010
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.	MO-293B	Sep 2021
Item 11.10-459 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Dual-In-Line Package. Item 11.10-297.	MO-127-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Module. Recission of Variation AB.	MO-040-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power PQFP with Heat Slug. Item 11.11-559.	MO-188-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.	MO-267-B	Feb 2006
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-	MO-033-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.	MO-030-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035	MO-029-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.	MO-031-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.	MO-070-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.	MO-157-C	Apr 2005
Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.	MO-242-C	Sep 2008
Item 11.4-800 Patents(): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.	MO-264-A	Nov 2005
Item 11.4-731 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.	MO-212-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044. Status: Rescinded	MO-177-A	Jun 1999
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.	MO-036-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292.	MO-110-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.	MO-296B	Jan 2012
Item 11.11-849 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.	MO-154-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.	MO-118-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package	MO-349A.01	Aug 2022
Item: 11.4-996E Designator: SBGA-M7775[23828]_D0p073... Item: 11.4-996 Access STP Files for MO-349A Cross Reference: DR4.26 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package	MO-316B	Apr 2019
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Single-In-Line (SIP) Family. Item 11.3-79.	MO-035-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Single-In-Line Power Module. Item 11.3-128.	MO-045-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Slim Lite SSD Assembly. DIM.	MO-297-A	May 2009
Item 11.14-130 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0.050 inch Lead Spacing. Item 11.11-217.	MO-099-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.	MO-046-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.	MO-184-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.	MO-077-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.	MO-124-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.	MO-147-A	Jul 1994
Item 11.10-321 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206.	MO-088-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.	MO-200-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.	MO-271-A	Jun 2006
Item 11.11-738 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.	MO-117-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.	MO-123-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.	MO-186-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.	MO-207N	Jun 2013
Item 11.4-846 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432	MO-156-C	Apr 2005
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.	MO-228-A	Mar 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635	MO-238-A	Feb 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429. April 2003	MO-201-A	Oct 1997
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Standard and Low, Fine Pitch Rectangular Ball Grid Array Family, 0.65 mm Pitch. FR-XBGA, LFR-XBGA.	MO-301A	May 2010
Item 11.11-828 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Surface Mount Power Package with fused leads. H-PSOF	MO-299B	Jan 2015
Item 11.11-902 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.	MO-149-F	Oct 2003
Committee(s): JC-11.11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329.	MO-109-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TapePak´ Molded Carrier Ring Family. Zero Degree Minimum Lead Bend. Item 11.11-328.	MO-094-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA	MO-158-D	Apr 2002
Patents(): IBM: 4,914,814 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.	MO-254-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.	MO-251-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB.	MO-243-A	Jul 2003
Item 11.11-661 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.	MO-220-K.01	Aug 2011
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.

Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.

Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.

Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.

Registration - Power Dual-In-Line Package. Item 11.10-297.

Registration - Power Module. Recission of Variation AB.

Registration - Power PQFP with Heat Slug. Item 11.11-559.

Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.

Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-

Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.

Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035

Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.

Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.

Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.

Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.

Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044.

Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.

Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292.

Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.

Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.

Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.

Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package

Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package

Registration - Single-In-Line (SIP) Family. Item 11.3-79.

Registration - Single-In-Line Power Module. Item 11.3-128.

Registration - Slim Lite SSD Assembly. DIM.

Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0.050 inch Lead Spacing. Item 11.11-217.

Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.

Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.

Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.

Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.

Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.

Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.

Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206.

Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.

Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.

Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.

Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.

Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.

Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.

Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432

Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.

Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635

Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.

Registration - Standard and Low, Fine Pitch Rectangular Ball Grid Array Family, 0.65 mm Pitch. FR-XBGA, LFR-XBGA.

Registration - Surface Mount Power Package with fused leads. H-PSOF

Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.

Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329.

Registration - TapePak´ Molded Carrier Ring Family. Zero Degree Minimum Lead Bend. Item 11.11-328.

Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA

Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.

Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.

Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB.

Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.

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