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Title	Document #	Date
Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.	MO-129-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSOP I, 7.62 mm Body. Item 11.11-346.	MO-132-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.	MO-131-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.	MO-135-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311.	MO-139-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312.	MO-140-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E	MO-142-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319.	MO-141-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).	MO-143-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.	MO-145-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320.	MO-146-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP). R-PSDO-G/SSOP. Item 11.11-440.	MO-152-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.	MO-154-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline (SOP), 5-Lead. Item 11.11-364.	MO-155-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic CGA Rectangular. Item 11.10-371.	MO-159-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.	MO-160-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flatpack/Heat Slug Package, 0.8 mm Pitch, 48 Leads. Item 11.11-370.	MO-162-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink SO Package Family, 9.9 mm Wide Body, 36 and 70 Pins R-PDSO-G . Item 11.11-331	MO-164-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455	MO-165-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic SO with Heat Slug, 20, 24, 30, 36 leads. Addition of a 44 lead (0.65 mm pitch) Plastic Heat Slug Package. Variations AA-AE. Item 11.11-551.	MO-166-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Isolated Flange-Mounted Header Family. Variations AA-AB. Item 11.10-344.	MO-168-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.	MO-167-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 88 Pin Memory Card. Item 11.14-012.	MO-171-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.	MO-170-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.	MO-172-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.	MO-173-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.	MO-175-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401.	MO-174-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.	MO-176-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.	MO-179-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418.	MO-181-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.	MO-183-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.	MO-184-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.	MO-185-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.	MO-186-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451.	MO-189-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power PQFP with Heat Slug. Item 11.11-559.	MO-188-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027.	MO-191-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492.	MO-194-B
JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.	MO-197-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.	MO-196-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3-Tier Family. PQFP-B. Item 11.11-473.	MO-198-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.	MO-199-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.	MO-200-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.	MO-202-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507.	MO-209-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.	MO-212-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393	MO-218-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.	MO-223-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-026-C. Item 11.11-483S.	MO-136-A
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).	MO-163-B
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390).	MO-003-C
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392).	MO-019-D
Committee(s): JC-11 JEP95 Registrations Main Page
RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.	MO-101-A
Committee(s): JC-11 JEP95 Registrations Main Page
RESCINDED - Tape Quad Flatpack Family.	MO-102-A
Committee(s): JC-11 JEP95 Registrations Main Page

Standards & Documents Search

Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.

Registration - TSOP I, 7.62 mm Body. Item 11.11-346.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.

Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.

Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311.

Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312.

Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E

Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319.

Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).

Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320.

Registration - Plastic Shrink Small Outline Package (SSOP). R-PSDO-G/SSOP. Item 11.11-440.

Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.

Registration - Plastic Small Outline (SOP), 5-Lead. Item 11.11-364.

Registration - Ceramic CGA Rectangular. Item 11.10-371.

Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.

Registration - Plastic Flatpack/Heat Slug Package, 0.8 mm Pitch, 48 Leads. Item 11.11-370.

Registration - Plastic Shrink SO Package Family, 9.9 mm Wide Body, 36 and 70 Pins R-PDSO-G . Item 11.11-331

Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455

Registration - Plastic SO with Heat Slug, 20, 24, 30, 36 leads. Addition of a 44 lead (0.65 mm pitch) Plastic Heat Slug Package. Variations AA-AE. Item 11.11-551.

Registration - Plastic Isolated Flange-Mounted Header Family. Variations AA-AB. Item 11.10-344.

Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.

Registration - 88 Pin Memory Card. Item 11.14-012.

Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.

Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.

Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.

Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.

Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401.

Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.

Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.

Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-418.

Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.

Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.

Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.

Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.

Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.

Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451.

Registration - Power PQFP with Heat Slug. Item 11.11-559.

Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027.

Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492.

Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.

Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.

Registration - 3-Tier Family. PQFP-B. Item 11.11-473.

Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.

Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.

Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.

Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507.

Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.

Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393

Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.

Replaced - See MS-026-C. Item 11.11-483S.

Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390).

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392).

RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.

RESCINDED - Tape Quad Flatpack Family.

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