Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317. |
MO-134-A | May 1992 |
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Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274. |
MO-026-D | Jul 1991 |
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Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214. |
MO-059-B | Jan 1987 |
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Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM. |
MO-001-F | Jun 1983 |
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Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514. |
MO-213-A | Dec 1969 |
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Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100. |
MO-006-C | |
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Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB. |
MO-005-B | |
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Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA. |
MO-018-C | |
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Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC. |
MO-017-B | |
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Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD. |
MO-020-C | |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035 |
MO-029-B | |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033. |
MO-031-D | |
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Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037. |
MO-030-B | |
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Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10- |
MO-033-B | |
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Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064. |
MO-032-C | |
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Registration - Single-In-Line (SIP) Family. Item 11.3-79. |
MO-035-A | |
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Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278. |
MO-034-C | |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S. |
MO-037-A | |
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Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385). |
MO-058-B | |
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Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278. |
MO-060-B | |
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Replaced - See MS-027-A. Item 11.11-404S. |
MO-061-A | |
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Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235. |
MO-062-A | |
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Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009. |
MO-064-C | |
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Registration - Plastic Small Outline J-Lead (SOJ) .300 inch Wide Body Family, 0.050 Lead Spacing, 24 and 26 Pins. Item 11.11-216.. |
MO-065-A | |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122. |
MO-066-C | |
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Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004. |
MO-068-B | |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122. |
MO-067-B | |
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Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233. |
MO-070-A | |
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Registration - Plastic Quad Flatpack .025 inch Lead Spacing (Gullwing). Item 11.11-285. |
MO-069-B | |
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Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284. |
MO-072-B | |
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Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284. |
MO-107-A | |
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Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329. |
MO-109-B | |
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Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292. |
MO-110-A | |
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Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422. |
MO-112-B | |
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Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302. |
MO-115-A | |
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Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357 |
MO-114-C | |
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Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S. |
MO-116-B | |
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Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289. |
MO-117-A | |
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Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309. |
MO-118-B | |
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Registration - Plastic Small Outline (SO) Package Family With .300 inch Body Width. Item 11.11-298. |
MO-119-B | |
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Registration - Plastic Small Outline (SO) Package Family With .350 inch Body Width. Item 11.11-300. |
MO-120-B | |
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Registration - Plastic Small Outline (SO) Package Family. J-Lead, .330 inch Body Width. Item 11.11-301. |
MO-121-B | |
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Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318. |
MO-122-A | |
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Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304. |
MO-123-A | |
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Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371. |
MO-124-B | |
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Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303. |
MO-125-A | |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318. |
MO-126-B | |
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Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365. |
MO-128-C | |
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Registration - Power Dual-In-Line Package. Item 11.10-297. |
MO-127-A | |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299. |
MO-130-A | |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298. |
MO-129-A | |
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Registration - TSOP I, 7.62 mm Body. Item 11.11-346. |
MO-132-B | |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
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Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311. |
MO-139-A | |
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Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312. |
MO-140-A | |
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Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E |
MO-142-D | |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
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Replaced - See MS-026-C. Item 11.11-483S. |
MO-136-A | |
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Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch). |
MO-163-B | |
Committee(s): JC-11 |