Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly |
MO-347A | Mar 2021 |
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1 Patents(): Kioxia: 1705380 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick |
MO-193G | Feb 2021 |
Designator: PDSO-G#_I0P##-##... Item 11.11-990 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package |
MO-210Q | Jan 2021 |
Designator: PBGA-B#[#]_I0p... Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package |
MO-216G | Jan 2021 |
Designator: PBGA-B#[#]_I80... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch, Rectangular Family Package |
MO-276P | Jan 2021 |
Designator: PBGA-B#[#]_I0p5... Cross Reference: DR4.5 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package |
MO-346A | Nov 2020 |
Designator: PQFP-B#[#]_I0p65... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick |
MO-345A | Oct 2020 |
Designator: PDSO-G#_I0P5-##... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick |
MO-178D | Sep 2020 |
Item 11.10-458 Committee(s): JC-11.10 Free download. Registration or login required. |
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Registration - 12 Pin UFS Card, 0.91 mm Pitch |
MO-320B | Sep 2020 |
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 288 Pin DDR5 DIMM, 0.85 mm Pitch Microelectronic Assembly |
MO-329C | Sep 2020 |
Designator: PDMA-N288-I0p85-R133p8x... Patents(): Micron: 7,547,213. Committee(s): JC-11.14 Free download. Registration or login required. |
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REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package |
MO-344A | Aug 2020 |
Designator: PBGA-B#[#]_I0p40... Cross Reference: DR4.18 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Surface, 2 Terminal, Wettable Flank Package |
MO-343A | Mar 2020 |
Designator: PDSO-N2-I#-R#x#Z#-CturET0p04 Patents(): Nexperia BV: US8809121 B2 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package |
MO-328B | Feb 2020 |
Designator: PBGA-B#[#]_I0p75... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package |
MO-311E | Feb 2020 |
Designator: PBGA-B#[#]_I0p65... Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.65 mm Pitch Square Family Package |
MO-342A | Jan 2020 |
Designator: PBGA-B#[#}_I0p65 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline Surface Terminal, Wettable Flank Package |
MO-340A | Oct 2019 |
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package |
MO-341A | Oct 2019 |
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Flatpack 28 Terminal Package |
MO-339A | Sep 2019 |
Item 11-11.975, Access STP File for MO-339A Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package |
MO-338A | Sep 2019 |
Item 11.11-973, Access STP Files for MO-338A Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package |
MO-316B | Apr 2019 |
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - 262 Pin SODIMM, 0.50 mm Pitch Package |
MO-337A | Apr 2019 |
Item 14-192 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family |
MO-336A | Nov 2018 |
Item 11-11.963, Access STP File for MO-336A Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Single Sided Hardware 7 Wire 1.2 mm Pitch Package. P-PSXH-W7_I120 |
MO-334A | Sep 2018 |
Item No. 11.14-190 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35 |
MO-333A | Aug 2018 |
Item 11.11-952 Free download. Registration or login required. |
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Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17. |
MO-332A | Aug 2018 |
Item 11.11-958, Access STP File for MO-332A Free download. Registration or login required. |
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REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA |
MO-330A | Jun 2018 |
Item 11.11-955 Free download. Registration or login required. |
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Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B. |
MO-331A | Jun 2018 |
Item 11.11-960 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA. |
MO-234E | Jun 2018 |
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Free download. Registration or login required. |
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Registration - Plastic Thin Shrink Small Outline Package. PDSO- |
MO-153G | Jan 2018 |
Item 11.11-603 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA |
MO-317C | Jan 2018 |
Item 11.11-949 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA |
MO-322A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA |
MO-321A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA |
MO-323A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA |
MO-318B | Jan 2017 |
Item 11.11-934 Outline Cross Reference: Design Registration 4.14 (DR4.14) Patents(): May apply: National – 4688152, 4778641, 4868349. Citizen – 4822550, 4935581 Free download. Registration or login required. |
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Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF |
MO-327A | Sep 2016 |
Item No. 11-925 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA. |
MO-302C | Aug 2016 |
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-324A | Aug 2016 |
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-325A | Aug 2016 |
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-326A | Aug 2016 |
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH |
MO-314A.02 | Jul 2016 |
Item 14-183, Minor Editorial Revision Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF |
MO-319A | Feb 2016 |
Item No. 11-912 Patents(): Infineon Technologies AG: 2011012439 A1 (US), 10 2010 060 801 A1 (DE) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch. |
MO-246H | May 2015 |
Designator: (T,B) FR-XBGA Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM |
MO-309F | Mar 2015 |
Item No. 11.14-176 Free download. Registration or login required. |
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Registration - mSATA SSD Assembly. DIM. |
MO-300C | Mar 2015 |
Item 11.14-175 Free download. Registration or login required. |
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Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA |
MO-315A | Feb 2015 |
Item No. 11-903 Free download. Registration or login required. |
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Registration - Surface Mount Power Package with fused leads. H-PSOF |
MO-299B | Jan 2015 |
Item 11.11-902 Free download. Registration or login required. |
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Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO. |
MO-286B | Jan 2015 |
Item 11.10-450 Committee(s): JC-11.10 Free download. Registration or login required. |
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Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM |
MO-274D | Oct 2014 |
Item 11.14-171 Free download. Registration or login required. |
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Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA |
MO-313A | Aug 2014 |
Item No. 11-892 Free download. Registration or login required. |
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Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM |
MO-269J | Apr 2014 |
Item 11.14-163 Free download. Registration or login required. |
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Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM |
MO-268E | Mar 2014 |
Item 11.14-151 Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM |
MO-310C | Feb 2014 |
Item No. 11.14-164 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS |
MO-305C | Oct 2013 |
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA |
MO-304D | Jul 2013 |
Item 11.11-882 Free download. Registration or login required. |
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Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB. |
MO-207N | Jun 2013 |
Item 11.4-846 Free download. Registration or login required. |
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Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF |
MO-312A | Feb 2013 |
Item No. 11-875 Free download. Registration or login required. |
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Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON. |
MO-240C | Aug 2012 |
Item 11.11-860 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON |
MO-229F | Aug 2012 |
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers. |
MO-244D | Jul 2012 |
Item No. 14-136 Patents(): Hitachi: 5,227,664 Free download. Registration or login required. |
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Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA |
MO-308A | Apr 2012 |
Item 11.11-853 Free download. Registration or login required. |