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Title	Document #	Date
Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package	MO-341A	Oct 2019
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1 Item: 11.11-959 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Surface Terminal, Wettable Flank Package	MO-340A	Oct 2019
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04 Item: 11.11-974, Access STP Files for MO-340A Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Flatpack 28 Terminal Package	MO-339A	Sep 2019
Item 11-11.975, STP File for MO-339A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package	MO-338A	Sep 2019
Item 11.11-973, Access STP Files for MO-338A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package	MO-316B	Apr 2019
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin SODIMM, 0.50 mm Pitch Package	MO-337A	Apr 2019
Item 14-192 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package	MO-216F	Nov 2018
PBGA-B#(#)_I80...Item 11-961 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family	MO-336A	Nov 2018
Item 11-11.963 STP File for MO-336A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Single Sided Hardware 7 Wire 1.2 mm Pitch Package. P-PSXH-W7_I120	MO-334A	Sep 2018
Item No. 11.14-190 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17.	MO-332A	Aug 2018
Item 11.11-958 STP File for MO-332A Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35	MO-333A	Aug 2018
Item 11.11-952 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA	MO-330A	Jun 2018
Item 11.11-955 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Fine Pitch Ball Grid Array Family, Rectangular, 0.80 mm Pitch. (V,T,L)FR-XBGA.	MO-210O	Jun 2018
Item 11.11-953Outline Cross Reference: Design Registration 4.6 (DR4.6) Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B.	MO-331A	Jun 2018
Item 11.11-960 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.	MO-234E	Jun 2018
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Fine Pitch Ball Grid Array Family, Rectangular , 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.	MO-276N	May 2018
Item 11.11-956 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Shrink Small Outline Package. PDSO-	MO-153G	Jan 2018
Item 11.11-603 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA	MO-317C	Jan 2018
Item 11.11-949 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
288 PIN DDR5 DIMM, 0.85 MM PITCH.	MO-329A	Aug 2017
Item 14-184 Patents(): Micron: 7,547,213. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA	MO-323A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA	MO-322A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA	MO-321A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangle, 0.75 mm Pitch	MO-328A	Jan 2017
Item 11.11-936 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA	MO-318B	Jan 2017
Item 11.11-934 Outline Cross Reference: Design Registration 4.14 (DR4.14) Patents(): May apply: National – 4688152, 4778641, 4868349. Citizen – 4822550, 4935581 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF	MO-327A	Sep 2016
Item No. 11-925 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.	MO-302C	Aug 2016
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-326A	Aug 2016
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-325A	Aug 2016
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-324A	Aug 2016
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH	MO-314A.02	Jul 2016
Item 14-183, Minor Editorial Revision Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Card, 0.91 mm Pitch	MO-320A	Mar 2016
Item 11.11-921 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF	MO-319A	Feb 2016
Item No. 11-912 Patents(): Infineon Technologies AG: 2011012439 A1 (US), 10 2010 060 801 A1 (DE) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch.	MO-246H	May 2015
Designator: (T,B) FR-XBGA Item: 11.11-906 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM	MO-309F	Mar 2015
Item No. 11.14-176 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD Assembly. DIM.	MO-300C	Mar 2015
Item 11.14-175 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA	MO-315A	Feb 2015
Item No. 11-903 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Surface Mount Power Package with fused leads. H-PSOF	MO-299B	Jan 2015
Item 11.11-902 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.	MO-286B	Jan 2015
Item 11.10-450 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-Pitch, Thin and Very Thin Profile, Rectangular Die Size BGA, 0.80 mm X 0.65 mm Pitch. (T,V)FR-xDSBGA	MO-311D	Dec 2014
Item No. 11-900 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM	MO-274D	Oct 2014
Item 11.14-171 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA	MO-313A	Aug 2014
Item No. 11-892 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM	MO-269J	Apr 2014
Item 11.14-163 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM	MO-268E	Mar 2014
Item 11.14-151 Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM	MO-310C	Feb 2014
Item No. 11.14-164 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS	MO-305C	Oct 2013
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Shrink Small Outline Package (Shrink SOT). TR-PDSO-G.	MO-193E	Jul 2013
Item 11-879 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA	MO-304D	Jul 2013
Item 11.11-882 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.	MO-207N	Jun 2013
Item 11.4-846 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF	MO-312A	Feb 2013
Item No. 11-875 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.	MO-244D	Jul 2012
Item No. 14-136 Patents(): Hitachi: 5,227,664 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA	MO-308A	Apr 2012
Item 11.11-853 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch	MO-303B	Mar 2012
Item No. 11.11-857 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.	MO-296B	Jan 2012
Item 11.11-849 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA	MO-307A	Dec 2011
Item 11.11-856 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.	MO-220-K.01	Aug 2011
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.	MO-275-A.01	Jul 2011
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.	MO-237-G.01	Apr 2011
Item 11.14-128, 11.14-128E Patents(): Hitachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA. Status: Rescinded March 2018	MO-273C	Mar 2011
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page

Standards & Documents Search

Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package

Registration - Plastic Dual Small Outline Surface Terminal, Wettable Flank Package

Registration - Plastic Bottom Flatpack 28 Terminal Package

Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package

Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package

Registration - 262 Pin SODIMM, 0.50 mm Pitch Package

Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package

Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family

Registration - Plastic Single Sided Hardware 7 Wire 1.2 mm Pitch Package. P-PSXH-W7_I120

Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17.

Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35

REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA

Registration - Fine Pitch Ball Grid Array Family, Rectangular, 0.80 mm Pitch. (V,T,L)FR-XBGA.

Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B.

Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.

Registration - Fine Pitch Ball Grid Array Family, Rectangular , 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.

Registration - Plastic Thin Shrink Small Outline Package. PDSO-

Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA

288 PIN DDR5 DIMM, 0.85 MM PITCH.

Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA

Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA

Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA

Registration - Ball Grid Array Family, Rectangle, 0.75 mm Pitch

Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA

Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF

Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.

Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH

Registration - 12 Pin UFS Card, 0.91 mm Pitch

Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF

Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch.

Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM

Registration - mSATA SSD Assembly. DIM.

Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA

Registration - Surface Mount Power Package with fused leads. H-PSOF

Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.

Registration - Dual-Pitch, Thin and Very Thin Profile, Rectangular Die Size BGA, 0.80 mm X 0.65 mm Pitch. (T,V)FR-xDSBGA

Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM

Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA

Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM

Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM

Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM

Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS

Registration - Plastic Thin Shrink Small Outline Package (Shrink SOT). TR-PDSO-G.

Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA

Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.

Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF

Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON

Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.

Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.

Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA

Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch

Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.

Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA

Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.

Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.

Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.

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