Global Standards for the Microelectronics Industry
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Document # | Date |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392). |
MO-019-D | |
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 |
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RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed. |
MO-101-A | |
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 |
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Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.Status: Elevated to MS-034 |
MO-151-D | Jun 1997 |
Item 11.11-555. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 |
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RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 |
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SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE (HBM4) |
MO-362B | Apr 2025 |
Designator: SBGA-M8236[56028]_I0p65-R14p175x10p975Z0p81 Item #: 4-1079
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 Free download. Registration or login required. |
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