Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124 |
MO-057-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124. |
MO-056-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206. |
MO-074-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic CGA Rectangular. Item 11.10-371. |
MO-159-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320. |
MO-146-A | |
Committee(s): JC-11 Free download. Registration or login required. |