Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388. |
MO-036-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing. |
MO-038-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing. |
MO-039-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Power Module. Recission of Variation AB. |
MO-040-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. |
MO-041-C | |
Committee(s): JC-11 Free download. Registration or login required. |