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Title	Document #	Date
288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY	MO-329H.01	Jun 2024
Designator: PDMA-N288-I0p85-R133p8x#p#7Z31p8R2p55x0p6 Item: 11.14-224, Access Cross Reference: MO-329, SO-023, GS-010 Patents(): Micron: US7,547,213. Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY	MO-358B	Jun 2024
Designator: XBNA-N#_I1p0_... Item No: 14-229 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY	MO-357C	Jun 2024
Designator: XBMA-H644_I1p0_R78p0x23p0Z2p6 Item #: 14-228 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE	MO-216H	Sep 2024
Designator: PBGA-B#[#]_I80... Item: 11-1064 Cross Reference: DR4.5 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-360A	May 2024
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-361A	Apr 2024
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 JEP95 Registrations Main Page Committee(s): JC-11, JC-11.11 Free download. Registration or login required.
PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-363A	Jul 2024
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE	MO-364A	Aug 2024
Designator:PDFN-N[#]_I1p27... Item #: 11-1063 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE	MO-359B	Jul 2024
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1049 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE	MO-203D	May 2024
Item 11-1051 Package Designator: PDSO-G#_... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE	MO-153I	Aug 2024
Package Designator: PDSO-G#-I##.... Item# - JC11.11-1069 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC DUAL SMALL OUTLINE, SURFACE TERMINAL, WETTABLE FLANK PACKAGE	MO-340D	Dec 2023
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04 Item: 11-1044 Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE	MO-354B	Sep 2024
Item: 11-1065 Designator: PMSO-E#_I1p14-... Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE	MO-356A	Aug 2023
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE	MO-339B	May 2024
Item 11-1054 Package Designator: PQFP-N28_I4p0... Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-324A	Aug 2016
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270	MO-085-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.	MO-060-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.	MO-145-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.	MO-041-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.	MO-042-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.	MO-075-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222.	MO-076-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122.	MO-067-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122.	MO-066-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243.	MO-083-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.	MO-263-A	Sep 2005
Item 11.11-734 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.	MO-262-A	Sep 2005
Item 11.11-733 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro.	MO-279A	Sep 2006
Item 11.14-093 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.	MO-172-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Card, 0.91 mm Pitch	MO-320B	Sep 2020
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.	MO-167-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus.	MO-277A	Sep 2006
Item 11.14-091 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.	MO-278A	Sep 2006
Item 11.14-092 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787	MO-253-B	Feb 2008
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.	MO-190-D	Jan 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.	MO-062-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.	MO-138-A	Jun 1993
Item 11.10-310 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311.	MO-139-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY

48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.

DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY

LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY

PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE

PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE

PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE

PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE

PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE

PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE

PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE

PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE

PLASTIC DUAL SMALL OUTLINE, SURFACE TERMINAL, WETTABLE FLANK PACKAGE

PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE

PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE

PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE

Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270

Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.

Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.

Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.

Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.

Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222.

Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122.

Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122.

Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243.

Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.

Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.

Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro.

Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.

Registration - 12 Pin UFS Card, 0.91 mm Pitch

Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.

Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus.

Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.

Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787

Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.

Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.

Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.

Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311.

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