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Title	Document #	Date
Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.	MO-208-C	Nov 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.	MO-217-B	Nov 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.	MO-231-A	Aug 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.	MO-221-C	Jun 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.	MO-204-B	Jun 2001
Item 11.11-586 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.	MO-228-A	Mar 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline Package with Exposed Heat Sink.	MO-230-A	Mar 2001
Item 11.11-574 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic SOP, 13.30 mm Wide Body, 1.27 mm Pitch, with addition of a 90 lead Small Outline Package as variation CA. Item 11.11-571.	MO-180-B	Feb 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.	MO-226-B	Feb 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.	MO-190-D	Jan 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 210 Pin SDRAM Dual-In-Line Memory Module (DIMM) Family, 1.00 mm Contact Centers. Item 11.14-039. This Outline is Now Inactive. Item 11.14-047.	MO-215-A	Nov 2000
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 232 Pin DDR SDRAM DIMM Family, 1.00 mm Pitch. Item 11.14-042 03/2003	MO-227-A	Nov 2000
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406	MO-169-B	Nov 2000
Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-024-E.	MO-133-A	Jan 2000
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044. Status: Rescinded	MO-177-A	Jun 1999
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429. April 2003	MO-201-A	Oct 1997
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA. Status: Elevated to MS-034	MO-151-D	Jun 1997
Item 11.11-555. Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.	MO-147-A	Jul 1994
Item 11.10-321 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP), 5.3 mm Body Width. R-PDSO-G.	MO-150-B	Jan 1994
Item 11.11-366 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.	MO-148-A	Jun 1993
Item 11.10-334 Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.	MO-138-A	Jun 1993
Item 11.10-310 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317.	MO-134-A	May 1992
Patents(): National Semiconductor: 4,796,080 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274.	MO-026-D	Jul 1991
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.	MO-001-F	Jun 1983
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.	MO-213-A	Dec 1969
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.	MO-002-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.	MO-002-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).	MO-004-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.	MO-006-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.	MO-005-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Family, Axial Lead, 7.62/8.25 Pin Circle.	MO-014-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.	MO-006-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276	MO-016-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.	MO-015-G
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA.	MO-018-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.	MO-017-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD.	MO-020-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC.	MO-021-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.

Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.

REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.

Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.

Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.

Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.

Registration - Plastic Small Outline Package with Exposed Heat Sink.

Registration - Plastic SOP, 13.30 mm Wide Body, 1.27 mm Pitch, with addition of a 90 lead Small Outline Package as variation CA. Item 11.11-571.

Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.

Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.

Registration - 210 Pin SDRAM Dual-In-Line Memory Module (DIMM) Family, 1.00 mm Contact Centers. Item 11.14-039. This Outline is Now Inactive. Item 11.14-047.

Registration - 232 Pin DDR SDRAM DIMM Family, 1.00 mm Pitch. Item 11.14-042

Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406

Replaced - See MS-024-E.

Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044.

Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.

Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.

Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.

Registration - Plastic Shrink Small Outline Package (SSOP), 5.3 mm Body Width. R-PDSO-G.

Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.

Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.

Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317.

Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274.

Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.

Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.

Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.

Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.

Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).

Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.

Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.

Registration - Flange-Mounted Family, Axial Lead, 7.62/8.25 Pin Circle.

Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.

Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276

Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.

Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA.

Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.

Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD.

Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC.

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