Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA |
MO-308A | Apr 2012 |
Item 11.11-853 Free download. Registration or login required. |
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Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch |
MO-303B | Mar 2012 |
Item No. 11.11-857 Free download. Registration or login required. |
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Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN. |
MO-296B | Jan 2012 |
Item 11.11-849 Free download. Registration or login required. |
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Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA |
MO-307A | Dec 2011 |
Item 11.11-856 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN. |
MO-220-K.01 | Aug 2011 |
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E. |
MO-275-A.01 | Jul 2011 |
Free download. Registration or login required. |
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Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers. |
MO-237-G.01 | Apr 2011 |
Item 11.14-128, 11.14-128E Patents(): Hitachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.Status: Rescinded March 2018 |
MO-273C | Mar 2011 |
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) |
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Registration - Flange Mounted Family Surface Mount (Peripheral Terminals). HR-PSFM-G. |
MO-306A | Feb 2011 |
Item 11.10-449. Free download. Registration or login required. |
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Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA. |
MO-222-B.01 | Dec 2010 |
Item 11.11-803, 11.11-842E Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO. |
MO-187-F | Sep 2010 |
Item 11.11-832 Free download. Registration or login required. |
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Registration - Standard and Low, Fine Pitch Rectangular Ball Grid Array Family, 0.65 mm Pitch. FR-XBGA, LFR-XBGA. |
MO-301A | May 2010 |
Item 11.11-828 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP. |
MO-292C | Apr 2010 |
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Free download. Registration or login required. |
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Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON. |
MO-236C | Mar 2010 |
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON. |
MO-252D | Mar 2010 |
Item 11.11-830. Free download. Registration or login required. |
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Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC. |
MO-137E | Mar 2010 |
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |
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Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA. |
MO-298-A | Jun 2009 |
Item 11.11-816 Free download. Registration or login required. |
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Registration - Slim Lite SSD Assembly. DIM. |
MO-297-A | May 2009 |
Item 11.14-130 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326 |
MO-266C | Jan 2009 |
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA. |
MO-294-A | Nov 2008 |
Item 11.11-804 Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB. |
MO-242-C | Sep 2008 |
Item 11.4-800 Patents(): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA. |
MO-270-B | Jun 2008 |
Item 11.11-790 Patents(): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Free download. Registration or login required. |
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Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787 |
MO-253-B | Feb 2008 |
Free download. Registration or login required. |
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Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD. |
MO-283-B | Jan 2008 |
Item 11.4-782 Patents(): Alien Technology Corp.: US11/127,697; US2006/016898(PCT); US11/159,526; US2006/0148166; US2005/040410(PCT). Committee(s): JC-11, JC-11.4, JC-65 Free download. Registration or login required. |
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Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers |
MO-290-A | Nov 2007 |
Item 11.14-118 Patents(): STAKTEK, See Outline Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON. |
MO-287-A | Sep 2007 |
Item 11.11-777 Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA. |
MO-225-C | Aug 2007 |
Item 11.11-761 and 11.11-761(E). Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA. |
MO-285-A | Aug 2007 |
Item 11.11-760 and 11.11-760(E) Free download. Registration or login required. |
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Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers. |
MO-256-F | Jun 2007 |
Item 11.14-108 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN. |
MO-247-D | May 2007 |
Item 11.11-767 Patents(): AIT, ASAT: See Outline Free download. Registration or login required. |
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Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA. |
MO-284-A | May 2007 |
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Free download. Registration or login required. |
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Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA. |
MO-219-G | Jan 2007 |
Item 11.11-763 Free download. Registration or login required. |
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Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers. |
MO-282-A | Jan 2007 |
Item 11.14-099 Patents(): STAKTEK: See Outline Committee(s): JC-11 Free download. Registration or login required. |
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Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers. |
MO-260-C | Dec 2006 |
Item 11.14-101 Free download. Registration or login required. |
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Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers. |
MO-281-A | Nov 2006 |
Item 11.14-100 Patents(): STAKTEK: See Outline Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected |
MO-224-E | Nov 2006 |
Item 11-074(e) and 14-106(e) Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |