Standards & Documents Search

Displaying 101 - 120 of 357 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302.	MO-115-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357	MO-114-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.	MO-116-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.	MO-117-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.	MO-118-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline (SO) Package Family With .300 inch Body Width. Item 11.11-298.	MO-119-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline (SO) Package Family With .350 inch Body Width. Item 11.11-300.	MO-120-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline (SO) Package Family. J-Lead, .330 inch Body Width. Item 11.11-301.	MO-121-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.	MO-122-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.	MO-123-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.	MO-124-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.	MO-125-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.	MO-126-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.	MO-128-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Dual-In-Line Package. Item 11.10-297.	MO-127-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299.	MO-130-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.	MO-129-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSOP I, 7.62 mm Body. Item 11.11-346.	MO-132-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.	MO-131-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.	MO-135-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302.

Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357

Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.

Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.

Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.

Registration - Plastic Small Outline (SO) Package Family With .300 inch Body Width. Item 11.11-298.

Registration - Plastic Small Outline (SO) Package Family With .350 inch Body Width. Item 11.11-300.

Registration - Plastic Small Outline (SO) Package Family. J-Lead, .330 inch Body Width. Item 11.11-301.

Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.

Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.

Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.

Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.

Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.

Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.

Registration - Power Dual-In-Line Package. Item 11.10-297.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.

Registration - TSOP I, 7.62 mm Body. Item 11.11-346.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.

Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: