Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
---|---|---|
Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027. |
MO-191-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492. |
MO-194-B | |
Free download. Registration or login required. |
||
Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498. |
MO-197-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508. |
MO-196-C | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 3-Tier Family. PQFP-B. Item 11.11-473. |
MO-198-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512. |
MO-199-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513. |
MO-200-B | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496. |
MO-202-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507. |
MO-209-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511. |
MO-212-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393 |
MO-218-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
Committee(s): JC-11 Free download. Registration or login required. |
||
Replaced - See MS-026-C. Item 11.11-483S. |
MO-136-A | |
Committee(s): JC-11 |
||
Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch). |
MO-163-B | |
Committee(s): JC-11 |
||
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390). |
MO-003-C | |
Committee(s): JC-11 |
||
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392). |
MO-019-D | |
Committee(s): JC-11 |
||
RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed. |
MO-101-A | |
Committee(s): JC-11 |
||
RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
Committee(s): JC-11 |
Pages
- « first
- ‹ previous
- …
- 16
- 17
- 18