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Title	Document #	Date
SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE	MO-362A	Nov 2024
Designator: SBGA-M16148[49588]_D0p068... Item #: 4-1056 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
RESCINDED - Tape Quad Flatpack Family.	MO-102-A
Committee(s): JC-11 JEP95 Registrations Main Page
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA. Status: Elevated to MS-034	MO-151-D	Jun 1997
Item 11.11-555. Committee(s): JC-11 JEP95 Registrations Main Page
RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.	MO-101-A
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392).	MO-019-D
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).	MO-004-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390).	MO-003-C
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385).	MO-058-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).	MO-143-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).	MO-163-B
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-027-A. Item 11.11-404S.	MO-061-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-026-C. Item 11.11-483S.	MO-136-A
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-024-E.	MO-133-A	Jan 2000
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).	MO-052-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218.	MO-080-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.	MO-054-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS	MO-305C	Oct 2013
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.	MO-217-B	Nov 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA. Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326	MO-266C	Jan 2009
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 JEP95 Registrations Main Page
Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.	MO-225-C	Aug 2007
Item 11.11-761 and 11.11-761(E). Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE

RESCINDED - Tape Quad Flatpack Family.

Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.

RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392).

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390).

Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385).

Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).

Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).

Replaced - See MS-027-A. Item 11.11-404S.

Replaced - See MS-026-C. Item 11.11-483S.

Replaced - See MS-024-E.

Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).

Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218.

Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.

Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS

Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.

Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.

Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.

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