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Title	Document #	Date
Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207.	MO-055-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.	MO-128-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.	MO-073-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.	MO-176-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.	MO-226-B	Feb 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620. This document is being removed based on decission by the Chair under directive from the BoD, letter is attached	MO-220-D	Feb 2002
This registration has been removed. Please 'open file' for more information regarding this issue. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers.	MO-260-C	Dec 2006
Item 11.14-101 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM	MO-274D	Oct 2014
Item 11.14-171 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.	MO-237-G.01	Apr 2011
Item 11.14-128, 11.14-128E Patents(): Hitachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.	MO-281-A	Nov 2006
Item 11.14-100 Patents(): STAKTEK: See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers	MO-290-A	Nov 2007
Item 11.14-118 Patents(): STAKTEK, See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.	MO-211-C	Jun 2004
Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.	MO-241-B	Aug 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.	MO-001-F	Jun 1983
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078	MO-206-E	Jan 2006
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA	MO-315A	Feb 2015
Item No. 11-903 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274.	MO-026-D	Jul 1991
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB.	MO-024-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027.	MO-028-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266.	MO-095-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207.

Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.

Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.

Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.

Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.

Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.

Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers.

Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM

Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.

Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.

Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers

Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.

Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.

Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.

Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078

Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA

Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274.

Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB.

Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027.

Registration - Dual-In-Line (Wide Body) Plastic Family .300 inch Row Spacing. Item 11.11-262/266.

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