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Title	Document #	Date
Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF	MO-312A	Feb 2013
Item No. 11-875 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.	MO-072-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.	MO-175-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.	MO-223-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF	MO-319A	Feb 2016
Item No. 11-912 Patents(): Infineon Technologies AG: 2011012439 A1 (US), 10 2010 060 801 A1 (DE) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.	MO-092-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278.	MO-034-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.	MO-170-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.	MO-116-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.	MO-160-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.	MO-185-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 84 Pin DDIMM, 0.60 mm Pitch Microelectronic Assembly	MO-335A	Apr 2021
Designator: PDMA-N84-I0p6-R85p13xY#Z#R1p98x0p43 Item: 11.14-191, Access STP Files for MO-335A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 88 Pin Memory Card. Item 11.14-012.	MO-171-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF	MO-327A	Sep 2016
Item No. 11-925 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049.	MO-214-B	Sep 2002
0.50 mm Lead Centers Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406	MO-169-B	Nov 2000
Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.	MO-017-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA	MO-330A	Jun 2018
Item 11.11-955 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA	MO-304D	Jul 2013
Item 11.11-882 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.	MO-234E	Jun 2018
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF

Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.

Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.

Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.

Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF

Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.

Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278.

Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.

Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.

Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.

Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.

Registration - 84 Pin DDIMM, 0.60 mm Pitch Microelectronic Assembly

Registration - 88 Pin Memory Card. Item 11.14-012.

Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF

Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049.

Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406

Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.

REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA

Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA

Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.

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