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Title	Document #	Date
Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680	MO-239-B	Nov 2002
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.	MO-265-A	Nov 2005
Item 11.11-722 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.	MO-231-A	Aug 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.	MO-261-A	Jun 2005
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA	MO-308A	Apr 2012
Item 11.11-853 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.	MO-122-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.	MO-295-A	Jan 2009
Item 11.11-795 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.	MO-173-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.	MO-105-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.	MO-135-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E	MO-142-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.	MO-249-A	Jan 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.	MO-195-D	May 2006
Item 11.11-704 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.	MO-284-A	May 2007
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.	MO-298-A	Jun 2009
Item 11.11-816 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299.	MO-130-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.	MO-129-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.	MO-131-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680

Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON

REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.

Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.

Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.

Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA

Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.

Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.

Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.

Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.

Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.

Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E

Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.

Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.

Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.

Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.

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