Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA |
MO-321A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA |
MO-317C | Jan 2018 |
Item 11.11-949 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA |
MO-323A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492. |
MO-194-B | |
Free download. Registration or login required. |
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Registration - TSOP I, 7.62 mm Body. Item 11.11-346. |
MO-132-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426. |
MO-183-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264. |
MO-090-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298. |
MO-129-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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