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Title	Document #	Date
Registration - Metal Enclosure for SSD Devices, E1.S and M.2	MO-348A	Jul 2021
Designator: MMXH-R(##)x36p75Z(##) Item: 11.14-205, Access STP Files for MO-348A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.	MO-108-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.	MO-112-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611	MO-233-C	Feb 2003
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD Assembly. DIM.	MO-300C	Mar 2015
Item 11.14-175 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.	MO-148-A	Jun 1993
Item 11.10-334 Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271	MO-100-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.	MO-125-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.	MO-250-A	Nov 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Metal Enclosure for SSD Devices, E1.S and M.2

Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.

Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.

Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.

Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611

Registration - mSATA SSD Assembly. DIM.

Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.

Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271

Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

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