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Title	Document #	Date
Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.	MO-072-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240.	MO-071-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.	MO-074-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.	MO-073-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.	MO-075-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222.	MO-076-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.	MO-077-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217.	MO-079-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.	MO-078-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224.	MO-081-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.

Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240.

Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.

Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.

Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.

Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222.

Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.

Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217.

Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.

Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224.

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