Global Standards for the Microelectronics Industry
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch.
Patents(): Amkor, ASAT, National Semiconductor: See Outline