Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package |
MO-349A.01 | Aug 2022 |
Item: 11.4-996E Designator: SBGA-M7775[23828]_D0p073...
Item: 11.4-996 Access STP Files for MO-349A Cross Reference: DR4.26 Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB. |
MO-207N | Jun 2013 |
Item 11.4-846 Free download. Registration or login required. |
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Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN. |
MO-296B | Jan 2012 |
Item 11.11-849 Free download. Registration or login required. |
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Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E. |
MO-275-A.01 | Jul 2011 |
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Free download. Registration or login required. |
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Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.Status: Rescinded March 2018 |
MO-273C | Mar 2011 |
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) |
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