Global Standards for the Microelectronics Industry
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Title | Document # |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |
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48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |