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Displaying 1 - 11 of 11 documents. Show 5 | 10 results per page.

Title	Document #	Date
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.	MO-286B	Jan 2015
Item 11.10-450 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM	MO-274D	Oct 2014
Item 11.14-171 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.	MO-137E	Mar 2010
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.	MO-236C	Mar 2010
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected	MO-224-E	Nov 2006
Item 11-074(e) and 14-106(e) Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.	MO-271-A	Jun 2006
Item 11.11-738 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.

Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM

Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON

Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.

Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.

Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected

Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.

48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.

Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.

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