Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |
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Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected |
MO-224-E | Nov 2006 |
Item 11-074(e) and 14-106(e) Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM |
MO-274D | Oct 2014 |
Item 11.14-171 Free download. Registration or login required. |
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Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC. |
MO-137E | Mar 2010 |
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Free download. Registration or login required. |
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Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO. |
MO-286B | Jan 2015 |
Item 11.10-450 Committee(s): JC-11.10 Free download. Registration or login required. |