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Displaying 1 - 5 of 11 documents. Show 5 | 10 results per page.

Title	Document #	Date
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.	MO-286B	Jan 2015
Item 11.10-450 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM	MO-274D	Oct 2014
Item 11.14-171 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.	MO-137E	Mar 2010
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.	MO-236C	Mar 2010
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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