Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 Free download. Registration or login required. |
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Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.Status: Elevated to MS-034 |
MO-151-D | Jun 1997 |
Item 11.11-555. Committee(s): JC-11 |
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