Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON. |
MO-287-A | Sep 2007 |
Item 11.11-777 Free download. Registration or login required. |
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Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214. |
MO-059-B | Jan 1987 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF. |
MO-293B | Sep 2021 |
Item 11.10-459 Committee(s): JC-11.10 Free download. Registration or login required. |