Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Plastic Small Outline Package with Exposed Heat Sink. |
MO-230-A | Mar 2001 |
Item 11.11-574 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Super Thin and Die Thin Profiles for RFID Dipole Straps. (X2, X4)-PUCD. |
MO-283-B | Jan 2008 |
Item 11.4-782 Patents(): Alien Technology Corp.: US11/127,697; US2006/016898(PCT); US11/159,526; US2006/0148166; US2005/040410(PCT). Committee(s): JC-11, JC-11.4, JC-65 Free download. Registration or login required. |
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Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599. |
MO-208-C | Nov 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON. |
MO-252D | Mar 2010 |
Item 11.11-830. Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678. |
MO-255-B | Oct 2005 |
Free download. Registration or login required. |