Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP. |
MO-292C | Apr 2010 |
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON. |
MO-252D | Mar 2010 |
Item 11.11-830. Free download. Registration or login required. |
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Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC. |
MO-137E | Mar 2010 |
With 0.025 inch Pitch, 0.150 inch Body Width. Item 11.11-831 Free download. Registration or login required. |
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Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON. |
MO-236C | Mar 2010 |
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 Free download. Registration or login required. |
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Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 Free download. Registration or login required. |