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Title	Document #	Date
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA. Status: Elevated to MS-034	MO-151-D	Jun 1997
Item 11.11-555. Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Plastic Small Outline Package with Exposed Heat Sink.	MO-230-A	Mar 2001
Item 11.11-574 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.	MO-204-B	Jun 2001
Item 11.11-586 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.

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