Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF. |
MO-293B | Sep 2021 |
Item 11.10-459 Committee(s): JC-11.10 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package |
MO-210Q | Jan 2021 |
Designator: PBGA-B#[#]_I0p... Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch. |
MO-246H | May 2015 |
Designator: (T,B) FR-XBGA Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON |
MO-229F | Aug 2012 |
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
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Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN. |
MO-220-K.01 | Aug 2011 |
Item 11.11-743(E). This outline replaces all previous issues. This is an editorial correction to modify the lead counts in Table 5C to match those of Table 9C for 12x12mm body 0.40 mm lead pitch. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |