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Title	Document #	Date
Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.	MO-270-B	Jun 2008
Item 11.11-790 Patents(): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.	MO-291-B	Dec 2008
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.	MO-295-A	Jan 2009
Item 11.11-795 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.	MO-252D	Mar 2010
Item 11.11-830. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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