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Title	Document #	Date
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Title

Document #

Date

MO-229F

Aug 2012

Item 11.11-861

Patents(): Amkor, ASAT, National Semiconductor: See Outline

Committee(s): JC-11, JC-11.11

Free download. Registration or login required.

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