Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM |
MO-269J | Apr 2014 |
Item 11.14-163 Free download. Registration or login required. |
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Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON. |
MO-240C | Aug 2012 |
Item 11.11-860 Free download. Registration or login required. |
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Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers. |
MO-244D | Jul 2012 |
Item No. 14-136 Patents(): Hitachi: 5,227,664 Free download. Registration or login required. |
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Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers. |
MO-237-G.01 | Apr 2011 |
Item 11.14-128, 11.14-128E Patents(): Hitachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON. |
MO-252D | Mar 2010 |
Item 11.11-830. Free download. Registration or login required. |