Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 3 of 3 documents.
Title | Document # | Date |
---|---|---|
Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB. |
MO-207N | Jun 2013 |
Item 11.4-846 Free download. Registration or login required. |
||
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB. |
MO-242-C | Sep 2008 |
Item 11.4-800 Patents(): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631. |
MO-211-C | Jun 2004 |
Committee(s): JC-11.4 Free download. Registration or login required. |