Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274. |
MO-026-D | Jul 1991 |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA |
MO-315A | Feb 2015 |
Item No. 11-903 Free download. Registration or login required. |
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Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078 |
MO-206-E | Jan 2006 |
Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM. |
MO-001-F | Jun 1983 |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662. |
MO-241-B | Aug 2003 |
Free download. Registration or login required. |
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Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631. |
MO-211-C | Jun 2004 |
Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - DDR3 SDRAM DIMM (Dual Inline Memory Module) Family, Flex-Based, 1.00 mm contact Centers |
MO-290-A | Nov 2007 |
Item 11.14-118 Patents(): STAKTEK, See Outline Committee(s): JC-11 Free download. Registration or login required. |
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Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers. |
MO-281-A | Nov 2006 |
Item 11.14-100 Patents(): STAKTEK: See Outline Committee(s): JC-11 Free download. Registration or login required. |
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Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers. |
MO-237-G.01 | Apr 2011 |
Item 11.14-128, 11.14-128E Patents(): Hitachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM |
MO-274D | Oct 2014 |
Item 11.14-171 Free download. Registration or login required. |
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Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers. |
MO-260-C | Dec 2006 |
Item 11.14-101 Free download. Registration or login required. |
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Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.This document is being removed based on decission by the Chair under directive from the BoD, letter is attached |
MO-220-D | Feb 2002 |
This registration has been removed. Please 'open file' for more information regarding this issue. Free download. Registration or login required. |
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Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589. |
MO-226-B | Feb 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353. |
MO-176-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206. |
MO-073-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365. |
MO-128-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207. |
MO-055-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S. |
MO-037-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing. |
MO-039-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing. |
MO-038-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369. |
MO-113-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224. |
MO-081-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317. |
MO-134-A | May 1992 |
Patents(): National Semiconductor: 4,796,080 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quad Flat Pack .050 inch Lead Spacing (Gullwing). Item 11.10-255. |
MO-084-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246. |
MO-082-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283. |
MO-104-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284. |
MO-107-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320. |
MO-146-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic CGA Rectangular. Item 11.10-371. |
MO-159-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206. |
MO-074-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124. |
MO-056-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124 |
MO-057-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217. |
MO-079-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302. |
MO-115-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B. |
MO-331A | Jun 2018 |
Item 11.11-960 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280. |
MO-098-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA |
MO-318B | Jan 2017 |
Item 11.11-934 Outline Cross Reference: Design Registration 4.14 (DR4.14) Patents(): May apply: National – 4688152, 4778641, 4868349. Citizen – 4822550, 4935581 Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA. |
MO-234E | Jun 2018 |
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA |
MO-304D | Jul 2013 |
Item 11.11-882 Free download. Registration or login required. |
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REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA |
MO-330A | Jun 2018 |
Item 11.11-955 Free download. Registration or login required. |
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Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC. |
MO-017-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406 |
MO-169-B | Nov 2000 |
Committee(s): JC-11.10 Free download. Registration or login required. |
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Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049. |
MO-214-B | Sep 2002 |
0.50 mm Lead Centers Free download. Registration or login required. |
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Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF |
MO-327A | Sep 2016 |
Item No. 11-925 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 88 Pin Memory Card. Item 11.14-012. |
MO-171-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 84 Pin DDIMM, 0.60 mm Pitch Microelectronic Assembly |
MO-335A | Apr 2021 |
Designator: PDMA-N84-I0p6-R85p13xY#Z#R1p98x0p43
Item: 11.14-191, Access STP Files for MO-335A Cross Reference: N/A Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022. |
MO-185-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017. |
MO-160-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S. |
MO-116-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010. |
MO-170-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278. |
MO-034-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270. |
MO-092-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF |
MO-319A | Feb 2016 |
Item No. 11-912 Patents(): Infineon Technologies AG: 2011012439 A1 (US), 10 2010 060 801 A1 (DE) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412. |
MO-175-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284. |
MO-072-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF |
MO-312A | Feb 2013 |
Item No. 11-875 Free download. Registration or login required. |
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Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly |
MO-347A | Mar 2021 |
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1
Item: 11.11-987, Access STP Files for MO-347A Cross Reference: N/A Patents(): Kioxia: 1705380 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009. |
MO-064-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 3-Tier Family. PQFP-B. Item 11.11-473. |
MO-198-A | |
Committee(s): JC-11 Free download. Registration or login required. |