Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317. |
MO-134-A | May 1992 |
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Registration - Dual-In-Line (DIP) Family Plastic Shrink Package, .400 inch Row Spacing, .070 inch Pitch, 30, 32 and 36 Leads. Item 11.11-274. |
MO-026-D | Jul 1991 |
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Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214. |
MO-059-B | Jan 1987 |
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Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM. |
MO-001-F | Jun 1983 |
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Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514. |
MO-213-A | Dec 1969 |
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Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD. |
MO-020-C | |
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Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207. |
MO-055-A | |
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Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286. |
MO-087-B | |
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Registration - Plastic Small Outline (SO) Package Family. J-Lead, .330 inch Body Width. Item 11.11-301. |
MO-121-B | |
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Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017. |
MO-160-B | |
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Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513. |
MO-200-B | |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033. |
MO-031-D | |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122. |
MO-066-C | |
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Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280. |
MO-098-A | |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
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Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412. |
MO-175-A | |
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Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393 |
MO-218-A | |
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RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed. |
MO-101-A | |
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Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79. |
MO-002-B | |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. |
MO-041-C | |
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Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400. |
MO-077-D | |
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Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293. |
MO-111-A | |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
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Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022. |
MO-185-A | |
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Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC. |
MO-021-C | |
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Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124 |
MO-057-A | |
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Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206. |
MO-088-A | |
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Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318. |
MO-122-A | |
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Registration - Plastic Flatpack/Heat Slug Package, 0.8 mm Pitch, 48 Leads. Item 11.11-370. |
MO-162-A | |
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Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037. |
MO-030-B | |
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Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004. |
MO-068-B | |
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Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0.050 inch Lead Spacing. Item 11.11-217. |
MO-099-A | |
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Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm Variation. Item 11.11-401. |
MO-174-A | |
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RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
Committee(s): JC-11 |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391). |
MO-004-C | |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101. |
MO-042-A | |
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Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217. |
MO-079-A | |
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Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369. |
MO-113-D | |
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Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320. |
MO-146-A | |
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Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E. |
MO-186-C | |
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Registration - Flatpack Family .700 Width, .050 Pitch. Variation AE. Item 11.3-077 |
MO-022-A | |
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Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124. |
MO-056-A | |
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Registration - Plastic Quad Flatpack Family, .050 inch Lead Spacing (Gullwing). Item 11.11-231. |
MO-089-A | |
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Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304. |
MO-123-A | |
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Registration - Plastic Shrink SO Package Family, 9.9 mm Wide Body, 36 and 70 Pins R-PDSO-G . Item 11.11-331 |
MO-164-A | |
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Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496. |
MO-202-A | |
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Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10- |
MO-033-B | |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122. |
MO-067-B | |
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Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271 |
MO-100-A | |
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Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100. |
MO-006-C | |
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Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143. |
MO-043-A | |
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Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249. |
MO-078-A | |
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Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422. |
MO-112-B | |
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Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451. |
MO-189-A | |
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Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item |
MO-022-D | |
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Registration - Plastic Small Outline J-Lead (SOJ) .350 Wide Body Family, 28 Pins. Item 11.11-232. |
MO-091-A | |
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Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371. |
MO-124-B | |
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Registration - Plastic Small Outline J-Lead (SOJ), 10.15 mm Body Width, .8 mm pitch R-PDSO-J. Addition of 44 Pin Variation. Item 11.11-455 |
MO-165-C | |
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Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064. |
MO-032-C | |
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Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233. |
MO-070-A | |
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