Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
---|---|---|
Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile. |
MO-278A | Sep 2006 |
Item 11.14-092 Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus. |
MO-277A | Sep 2006 |
Item 11.14-091 Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752. |
MO-205-G | Jul 2006 |
Free download. Registration or login required. |
||
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP. |
MO-248-E | Jun 2006 |
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
||
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP. |
MO-271-A | Jun 2006 |
Item 11.11-738 Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP. |
MO-272-A | May 2006 |
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Free download. Registration or login required. |
||
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA. |
MO-195-D | May 2006 |
Item 11.11-704 Free download. Registration or login required. |
||
Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN. |
MO-267-B | Feb 2006 |
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
||
Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078 |
MO-206-E | Jan 2006 |
Committee(s): JC-11.14 Free download. Registration or login required. |
||
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN. |
MO-265-A | Nov 2005 |
Item 11.11-722 Free download. Registration or login required. |
||
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB. |
MO-264-A | Nov 2005 |
Item 11.4-731 Free download. Registration or login required. |
||
Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678. |
MO-255-B | Oct 2005 |
Free download. Registration or login required. |
||
Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN. |
MO-263-A | Sep 2005 |
Item 11.11-734 Free download. Registration or login required. |
||
Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN. |
MO-262-A | Sep 2005 |
Item 11.11-733 Free download. Registration or login required. |
||
Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA. |
MO-261-A | Jun 2005 |
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Free download. Registration or login required. |
||
Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707. |
MO-257-B | May 2005 |
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Free download. Registration or login required. |
||
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432 |
MO-156-C | Apr 2005 |
Free download. Registration or login required. |
||
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433. |
MO-157-C | Apr 2005 |
Free download. Registration or login required. |
||
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |
||
Registration - 200 pin DDR MiniDIMM. 0.60 mm Lead Centers. Item 11.14-069. |
MO-258-A | Dec 2004 |
Free download. Registration or login required. |
||
Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631. |
MO-211-C | Jun 2004 |
Committee(s): JC-11.4 Free download. Registration or login required. |
||
Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657. |
MO-251-A | Feb 2004 |
Free download. Registration or login required. |
||
Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
Free download. Registration or login required. |
||
Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668. |
MO-249-A | Jan 2004 |
Free download. Registration or login required. |
||
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679. |
MO-250-A | Nov 2003 |
Free download. Registration or login required. |
||
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665. |
MO-149-F | Oct 2003 |
Committee(s): JC-11.11, JC-11.4 Free download. Registration or login required. |
||
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638. |
MO-245-A | Sep 2003 |
Free download. Registration or login required. |
||
Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662. |
MO-241-B | Aug 2003 |
Free download. Registration or login required. |
||
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA. |
MO-192-F | Jul 2003 |
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Free download. Registration or login required. |
||
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB. |
MO-243-A | Jul 2003 |
Item 11.11-661 Patents(): Amkor, ASAT, National Semiconductor: See Outline Free download. Registration or login required. |
||
Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635 |
MO-238-A | Feb 2003 |
Free download. Registration or login required. |
||
Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611 |
MO-233-C | Feb 2003 |
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Free download. Registration or login required. |
||
Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423. |
MO-235-B | Feb 2003 |
Free download. Registration or login required. |
||
Registration - 168 pin DIMM. Multiple Keyway Dual-In-Line Memory Module (DIMM), 1.27 mm contact centers. Addition of the 100 pin variation GA-XX and the INACTIVATION of the 168 pin right polarized configuration to DIMM registration. Item 11.14-055/056. |
MO-161-F | Dec 2002 |
Free download. Registration or login required. |
||
Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680 |
MO-239-B | Nov 2002 |
Free download. Registration or login required. |
||
Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049. |
MO-214-B | Sep 2002 |
0.50 mm Lead Centers Free download. Registration or login required. |
||
Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA |
MO-158-D | Apr 2002 |
Patents(): IBM: 4,914,814 Free download. Registration or login required. |
||
Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.This document is being removed based on decission by the Chair under directive from the BoD, letter is attached |
MO-220-D | Feb 2002 |
This registration has been removed. Please 'open file' for more information regarding this issue. Free download. Registration or login required. |
||
Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621. |
MO-217-B | Nov 2001 |
Free download. Registration or login required. |
||
Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599. |
MO-208-C | Nov 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
||
REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590. |
MO-231-A | Aug 2001 |
Free download. Registration or login required. |
||
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412 |
MO-232-A | Aug 2001 |
Free download. Registration or login required. |
||
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink. |
MO-204-B | Jun 2001 |
Item 11.11-586 Committee(s): JC-11.11 Free download. Registration or login required. |
||
Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604. |
MO-221-C | Jun 2001 |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581. |
MO-228-A | Mar 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
||
Registration - Plastic Small Outline Package with Exposed Heat Sink. |
MO-230-A | Mar 2001 |
Item 11.11-574 Committee(s): JC-11.11 Free download. Registration or login required. |
||
Registration - Plastic SOP, 13.30 mm Wide Body, 1.27 mm Pitch, with addition of a 90 lead Small Outline Package as variation CA. Item 11.11-571. |
MO-180-B | Feb 2001 |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589. |
MO-226-B | Feb 2001 |
Committee(s): JC-11.11 Free download. Registration or login required. |
||
Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048. |
MO-190-D | Jan 2001 |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - 232 Pin DDR SDRAM DIMM Family, 1.00 mm Pitch. Item 11.14-04203/2003 |
MO-227-A | Nov 2000 |
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11.14 Free download. Registration or login required. |
||
Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406 |
MO-169-B | Nov 2000 |
Committee(s): JC-11.10 Free download. Registration or login required. |
||
Registration - 210 Pin SDRAM Dual-In-Line Memory Module (DIMM) Family, 1.00 mm Contact Centers. Item 11.14-039. This Outline is Now Inactive. Item 11.14-047. |
MO-215-A | Nov 2000 |
Committee(s): JC-11.14 Free download. Registration or login required. |
||
Replaced - See MS-024-E. |
MO-133-A | Jan 2000 |
Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044.Status: Rescinded |
MO-177-A | Jun 1999 |
Free download. Registration or login required. |
||
Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.April 2003 |
MO-201-A | Oct 1997 |
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11 Free download. Registration or login required. |
||
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.Status: Elevated to MS-034 |
MO-151-D | Jun 1997 |
Item 11.11-555. Committee(s): JC-11 |
||
Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J. |
MO-147-A | Jul 1994 |
Item 11.10-321 Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Plastic Shrink Small Outline Package (SSOP), 5.3 mm Body Width. R-PDSO-G. |
MO-150-B | Jan 1994 |
Item 11.11-366 Committee(s): JC-11 Free download. Registration or login required. |
||
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP. |
MO-148-A | Jun 1993 |
Item 11.10-334 Free download. Registration or login required. |
||
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16. |
MO-138-A | Jun 1993 |
Item 11.10-310 Committee(s): JC-11 Free download. Registration or login required. |