Standards & Documents Search

Displaying 61 - 120 of 357 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.	MO-254-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA	MO-158-D	Apr 2002
Patents(): IBM: 4,914,814 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TapePak´ Molded Carrier Ring Family. Zero Degree Minimum Lead Bend. Item 11.11-328.	MO-094-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329.	MO-109-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.	MO-149-F	Oct 2003
Committee(s): JC-11.11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Surface Mount Power Package with fused leads. H-PSOF	MO-299B	Jan 2015
Item 11.11-902 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Standard and Low, Fine Pitch Rectangular Ball Grid Array Family, 0.65 mm Pitch. FR-XBGA, LFR-XBGA.	MO-301A	May 2010
Item 11.11-828 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429. April 2003	MO-201-A	Oct 1997
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635	MO-238-A	Feb 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.	MO-228-A	Mar 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432	MO-156-C	Apr 2005
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.	MO-207N	Jun 2013
Item 11.4-846 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.	MO-186-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.	MO-288-B	Sep 2009
Item 11.11-821 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.	MO-287-A	Sep 2007
Item 11.11-777 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.	MO-123-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.	MO-117-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.	MO-271-A	Jun 2006
Item 11.11-738 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.	MO-200-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206.	MO-088-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.	MO-147-A	Jul 1994
Item 11.10-321 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.	MO-124-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.	MO-077-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.	MO-184-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.	MO-046-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.	MO-059-B	Jan 1987
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0.050 inch Lead Spacing. Item 11.11-217.	MO-099-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Slim Lite SSD Assembly. DIM.	MO-297-A	May 2009
Item 11.14-130 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Single-In-Line Power Module. Item 11.3-128.	MO-045-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Single-In-Line (SIP) Family. Item 11.3-79.	MO-035-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package	MO-316B	Apr 2019
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package	MO-349A.01	Aug 2022
Item: 11.4-996E Designator: SBGA-M7775[23828]_D0p073... Item: 11.4-996 Access STP Files for MO-349A Cross Reference: DR4.26 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.	MO-118-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.	MO-154-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.	MO-296B	Jan 2012
Item 11.11-849 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292.	MO-110-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.	MO-036-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044. Status: Rescinded	MO-177-A	Jun 1999
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.	MO-212-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.	MO-264-A	Nov 2005
Item 11.4-731 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.	MO-242-C	Sep 2008
Item 11.4-800 Patents(): Micron and Staktek have stated that certain U.S. patents and patent applications may apply to configurations of this outline. These patents and applications are listed on sheet 9 of the outline. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.	MO-157-C	Apr 2005
Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.	MO-070-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.	MO-031-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035	MO-029-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.	MO-030-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-	MO-033-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.	MO-267-B	Feb 2006
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power PQFP with Heat Slug. Item 11.11-559.	MO-188-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Module. Recission of Variation AB.	MO-040-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Dual-In-Line Package. Item 11.10-297.	MO-127-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.	MO-293B	Sep 2021
Item 11.10-459 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.	MO-236C	Mar 2010
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.	MO-247-D	May 2007
Item 11.11-767 Patents(): AIT, ASAT: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.	MO-255-B	Oct 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.	MO-252D	Mar 2010
Item 11.11-830. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.	MO-196-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.	MO-197-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.

Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA

Registration - TapePak´ Molded Carrier Ring Family. Zero Degree Minimum Lead Bend. Item 11.11-328.

Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329.

Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.

Registration - Surface Mount Power Package with fused leads. H-PSOF

Registration - Standard and Low, Fine Pitch Rectangular Ball Grid Array Family, 0.65 mm Pitch. FR-XBGA, LFR-XBGA.

Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.

Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635

Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.

Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432

Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.

Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dimension in Detail A from 0.01 mm to 0.10 mm. Item 11.14-035E.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN.

Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. (U, X1, X2)F-PSON.

Registration - Small Outline, 64 Leads, 12 mm Body, J-Lead, 0.80 mm Lead Spacing. Item 11.11-304.

Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.

Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.

Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.

Registration - Small Outline J-Lead (SOJ) Family Peripheral terminals, 7.50 (.300 inch) Wide Body (MS-113 Body). Variations AA-AF. Item 11.11-206.

Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.

Registration - Small Outline J-Lead (SOJ) 12.70 mm Body 1.27 mm Lead Spacing. Item 11.11-371.

Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400.

Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.

Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.

Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.

Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0.050 inch Lead Spacing. Item 11.11-217.

Registration - Slim Lite SSD Assembly. DIM.

Registration - Single-In-Line Power Module. Item 11.3-128.

Registration - Single-In-Line (SIP) Family. Item 11.3-79.

Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package

Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package

Registration - Shrink Small Outline Package Family, 0.25 inch Lead Pitch .300 inch Wide Body. Item 11.11-309.

Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.

Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.

Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292.

Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384/388.

Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044.

Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.

Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.

Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.

Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033.

Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variation AA-AB. Item 11.3-034/035

Registration - Quad-In-Line (QUIP) Family, 19.05/23.50 mm Row Spacing. Item 11.3-037.

Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-

Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.

Registration - Power PQFP with Heat Slug. Item 11.11-559.

Registration - Power Module. Recission of Variation AB.

Registration - Power Dual-In-Line Package. Item 11.10-297.

Registration - Plastic, Ultra, Extra and Super Thin, Fine Pitch, Dual Small Outline, Flat, Leaded Package. (U, X1, X2)F-PSOF, HX2-PSOF.

Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.

Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.

Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.

Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.

Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.

Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: