Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH |
MO-314A.02 | Jul 2016 |
Item 14-183, Minor Editorial Revision Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM |
MO-309F | Mar 2015 |
Item No. 11.14-176 Free download. Registration or login required. |
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Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357 |
MO-114-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021. |
MO-179-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 262 Pin SODIMM, 0.50 mm Pitch Package |
MO-337A | Apr 2019 |
Item 14-192 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Package |
MO-337B | Feb 2022 |
Designator: PDMA-N262-I0p5-R69p6x3p7Z30p15R2p55x02p35
Item: 11.14-207,
Access STP Files for MO-337B
Cross Reference: SO-024 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM |
MO-310C | Feb 2014 |
Item No. 11.14-164 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers. |
MO-244D | Jul 2012 |
Item No. 14-136 Patents(): Hitachi: 5,227,664 Free download. Registration or login required. |
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Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM |
MO-269J | Apr 2014 |
Item 11.14-163 Free download. Registration or login required. |
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Registration - 232 Pin DDR SDRAM DIMM Family, 1.00 mm Pitch. Item 11.14-04203/2003 |
MO-227-A | Nov 2000 |
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 210 Pin SDRAM Dual-In-Line Memory Module (DIMM) Family, 1.00 mm Contact Centers. Item 11.14-039. This Outline is Now Inactive. Item 11.14-047. |
MO-215-A | Nov 2000 |
Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM |
MO-268E | Mar 2014 |
Item 11.14-151 Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected |
MO-224-E | Nov 2006 |
Item 11-074(e) and 14-106(e) Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 200 pin DDR MiniDIMM. 0.60 mm Lead Centers. Item 11.14-069. |
MO-258-A | Dec 2004 |
Free download. Registration or login required. |
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Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312. |
MO-140-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 168 pin DIMM. Multiple Keyway Dual-In-Line Memory Module (DIMM), 1.27 mm contact centers. Addition of the 100 pin variation GA-XX and the INACTIVATION of the 168 pin right polarized configuration to DIMM registration. Item 11.14-055/056. |
MO-161-F | Dec 2002 |
Free download. Registration or login required. |
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Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027. |
MO-191-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311. |
MO-139-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16. |
MO-138-A | Jun 1993 |
Item 11.10-310 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235. |
MO-062-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048. |
MO-190-D | Jan 2001 |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 14 & 16 Lead Screw Mount and Surface Mount Power Package. HB1-PDSO/HB1-PSOF. Item 11.11-787 |
MO-253-B | Feb 2008 |
Free download. Registration or login required. |
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Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile. |
MO-278A | Sep 2006 |
Item 11.14-092 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus. |
MO-277A | Sep 2006 |
Item 11.14-091 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029. |
MO-167-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 12 Pin UFS Card, 0.91 mm Pitch |
MO-320B | Sep 2020 |
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041. |
MO-172-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro. |
MO-279A | Sep 2006 |
Item 11.14-093 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN. |
MO-262-A | Sep 2005 |
Item 11.11-733 Free download. Registration or login required. |
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Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN. |
MO-263-A | Sep 2005 |
Item 11.11-734 Free download. Registration or login required. |
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Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243. |
MO-083-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122. |
MO-066-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122. |
MO-067-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222. |
MO-076-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221. |
MO-075-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101. |
MO-042-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. |
MO-041-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324. |
MO-145-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278. |
MO-060-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270 |
MO-085-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-324A | Aug 2016 |
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE |
MO-339B | May 2024 |
Item 11-1054 Package Designator: PQFP-N28_I4p0... Free download. Registration or login required. |
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PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE |
MO-356A | Aug 2023 |
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 Committee(s): JC-11.11 Free download. Registration or login required. |
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PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE |
MO-354B | Sep 2024 |
Item: 11-1065 Designator: PMSO-E#_I1p14-... Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, SURFACE TERMINAL, WETTABLE FLANK PACKAGE |
MO-340D | Dec 2023 |
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04
Item: 11-1044 Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE |
MO-153I | Aug 2024 |
Package Designator: PDSO-G#-I##.... Item# - JC11.11-1069 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE |
MO-203D | May 2024 |
Item 11-1051 Package Designator: PDSO-G#_... Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE |
MO-359B | Jul 2024 |
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1049
Free download. Registration or login required. |
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PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-364A | Aug 2024 |
Designator:PDFN-N[#]_I1p27... Item #: 11-1063
Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-363A | Jul 2024 |
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-361A | Apr 2024 |
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-360A | May 2024 |
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE |
MO-216H | Sep 2024 |
Designator: PBGA-B#[#]_I80... Item: 11-1064
Cross Reference: DR4.5 Free download. Registration or login required. |
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LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY |
MO-357D | Nov 2024 |
Designator: XBMA-H736_I1p0_R78p0x23p0Z2p6 Item #: 11.14-232 Free download. Registration or login required. |
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DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY |
MO-358B | Jun 2024 |
Designator: XBNA-N#_I1p0_... Item No: 14-229 Free download. Registration or login required. |
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48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |
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288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY |
MO-329I | Nov 2024 |
Designator: PDMA-N288-I0p85-R136p8x5p57Z31p8R2p55x0p6 Item: 14-230 Cross Reference: MO-329, SO-023, GS-010
Patents(): Micron: US7,547,213. Free download. Registration or login required. |
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