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Title	Document #	Date
Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680	MO-239-B	Nov 2002
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.	MO-265-A	Nov 2005
Item 11.11-722 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.	MO-231-A	Aug 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.	MO-261-A	Jun 2005
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA	MO-308A	Apr 2012
Item 11.11-853 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.	MO-122-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.	MO-295-A	Jan 2009
Item 11.11-795 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.	MO-173-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.	MO-105-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.	MO-135-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E	MO-142-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.	MO-249-A	Jan 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.	MO-195-D	May 2006
Item 11.11-704 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.	MO-284-A	May 2007
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.	MO-298-A	Jun 2009
Item 11.11-816 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299.	MO-130-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.	MO-129-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.	MO-131-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264.	MO-090-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.	MO-183-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSOP I, 7.62 mm Body. Item 11.11-346.	MO-132-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.	MO-280-A	Sep 2006
Item 11-759 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA	MO-317C	Jan 2018
Item 11.11-949 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA	MO-323A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA	MO-321A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA	MO-322A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA. Status: Rescinded March 2018	MO-273C	Mar 2011
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page
REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package	MO-344B	Aug 2023
Designator: PBGA-B#[#]_I0p40... Item: 11.11-1035, Access Cross Reference: DR4.18 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319.	MO-141-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.	MO-202-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP.	MO-292C	Apr 2010
Item 11.11-824 Patents(): Amkor; 6818973; 7211471 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.	MO-291-B	Dec 2008
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA.	MO-222-B.01	Dec 2010
Item 11.11-803, 11.11-842E Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.	MO-294-A	Nov 2008
Item 11.11-804 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.	MO-285-A	Aug 2007
Item 11.11-760 and 11.11-760(E) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.	MO-225-C	Aug 2007
Item 11.11-761 and 11.11-761(E). Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA. Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326	MO-266C	Jan 2009
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 JEP95 Registrations Main Page
Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.	MO-217-B	Nov 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS	MO-305C	Oct 2013
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.	MO-054-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218.	MO-080-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).	MO-052-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-024-E.	MO-133-A	Jan 2000
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-026-C. Item 11.11-483S.	MO-136-A
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-027-A. Item 11.11-404S.	MO-061-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).	MO-163-B
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).	MO-143-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385).	MO-058-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390).	MO-003-C
Committee(s): JC-11 JEP95 Registrations Main Page
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).	MO-004-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392).	MO-019-D
Committee(s): JC-11 JEP95 Registrations Main Page
RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.	MO-101-A
Committee(s): JC-11 JEP95 Registrations Main Page
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA. Status: Elevated to MS-034	MO-151-D	Jun 1997
Item 11.11-555. Committee(s): JC-11 JEP95 Registrations Main Page
RESCINDED - Tape Quad Flatpack Family.	MO-102-A
Committee(s): JC-11 JEP95 Registrations Main Page

Standards & Documents Search

Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680

Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON

REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.

Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.

Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.

Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA

Registration - Thin Dual-In-Line Family, 14, 16, and 18 Leads .300 inch Row Spacing (Plastic). R-PDIP-T. Item 11.11-318.

Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA.

Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.

Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.

Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.

Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E

Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.

Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.

Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA.

Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.

Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264.

Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.

Registration - TSOP I, 7.62 mm Body. Item 11.11-346.

Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.

Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA

Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA

Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA

Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA

Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.

REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package

Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319.

Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.

Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint (Staggered Dual Row). HVF-PQFP.

Registration - Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP.

Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA.

Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA.

Registration - Very Thin, Fine-Pitch, Rectangular, Ball Grid Array Family, 0.50/0.65/0.80 mm pitch. VFR-XBGA.

Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.

Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.

Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.

Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS

Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.

Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218.

Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).

Replaced - See MS-024-E.

Replaced - See MS-026-C. Item 11.11-483S.

Replaced - See MS-027-A. Item 11.11-404S.

Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).

Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).

Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385).

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390).

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).

Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, 10.16 mm Width, 1.27 Pitch. Variations AA-AD. Item 11.10-392).

RESCINDED - 48 Pin Ceramic Flatpack, Top Brazed.

Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.

RESCINDED - Tape Quad Flatpack Family.

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