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Title	Document #	Date
Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383	MO-103-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.	MO-043-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.	MO-015-G
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276	MO-016-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA	MO-307A	Dec 2011
Item 11.11-856 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004.	MO-068-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.	MO-270-B	Jun 2008
Item 11.11-790 Patents(): 7,056,476; 7,057,269; 6,933,598; 7,045,887; 6,906,416; 7,049,691; 7,053,477; 7,034,387; 6,838,761; 6,972,481; 7,061,088; 7,064,425; 7,101,731; 7,253,511; Applications: 20060226536; 20070278658 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.	MO-221-C	Jun 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293.	MO-111-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers.	MO-282-A	Jan 2007
Item 11.14-099 Patents(): STAKTEK: See Outline Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers.	MO-256-F	Jun 2007
Item 11.14-108 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA	MO-313A	Aug 2014
Item No. 11-892 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange Mounted Family Surface Mount (Peripheral Terminals). HR-PSFM-G.	MO-306A	Feb 2011
Item 11.10-449. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Family Axial Lead .600 inch Pin Circle. Item 11.10-273.	MO-097-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle.	MO-025-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Family, Axial Lead, 7.62/8.25 Pin Circle.	MO-014-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header, 7-Lead. Item 11.10-260.	MO-096-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family .700 Width, .050 Pitch. Variation AE. Item 11.3-077	MO-022-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064.	MO-032-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pins). Item 11.10-281.	MO-106-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA.	MO-018-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD.	MO-020-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC.	MO-021-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item	MO-022-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 22.86 mm Width, 1.27 Pitch. Variations AA-AB.	MO-023-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.	MO-005-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.	MO-002-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.	MO-002-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.	MO-006-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.	MO-006-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.	MO-078-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.	MO-245-A	Sep 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.	MO-213-A	Dec 1969
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.	MO-087-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch	MO-303B	Mar 2012
Item No. 11.11-857 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.	MO-044-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.	MO-027-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.	MO-144-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.	MO-126-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.	MO-086-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.	MO-199-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.	MO-192-F	Jul 2003
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.	MO-275-A.01	Jul 2011
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.	MO-219-G	Jan 2007
Item 11.11-763 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.	MO-302C	Aug 2016
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-325A	Aug 2016
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-326A	Aug 2016
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metal Enclosure for SSD Devices, E1.S and M.2	MO-348A	Jul 2021
Designator: MMXH-R(##)x36p75Z(##) Item: 11.14-205, Access STP Files for MO-348A Cross Reference: N/A Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.	MO-108-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.	MO-112-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611	MO-233-C	Feb 2003
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD Assembly. DIM.	MO-300C	Mar 2015
Item 11.14-175 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.	MO-148-A	Jun 1993
Item 11.10-334 Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271	MO-100-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.	MO-125-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.	MO-250-A	Nov 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383

Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.

Registration - Dual-In-Line Plastic (DIP) Family, .600 inch Row Spacing. Item 11.11-293.

Registration - Dual-In-Line Plastic (DIP) Family, .900 inch Row Spacing. Addition of 50, 52 and 64 Leads. Item 11.11-276

Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA

Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004.

Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.

Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.

Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293.

Registration - FBDIMM (Dual In-Line Memory Module) Family, Flex-Based, 1.00 mm Contact Centers.

Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers.

Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA

Registration - Flange Mounted Family Surface Mount (Peripheral Terminals). HR-PSFM-G.

Registration - Flange-Mounted Family Axial Lead .600 inch Pin Circle. Item 11.10-273.

Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle.

Registration - Flange-Mounted Family, Axial Lead, 7.62/8.25 Pin Circle.

Registration - Flange-Mounted Header, 7-Lead. Item 11.10-260.

Registration - Flatpack Family .700 Width, .050 Pitch. Variation AE. Item 11.3-077

Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064.

Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pins). Item 11.10-281.

Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA.

Registration - Flatpack Family, 12.70 mm Width, 1.27 Pitch. Variations AA-AD.

Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC.

Registration - Flatpack Family, 17.780 mm Width, 1.27 Pitch. Variations AA-AD. Item

Registration - Flatpack Family, 22.86 mm Width, 1.27 Pitch. Variations AA-AB.

Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.

Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79.

Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.

Registration - Header Family, 5.842 mm Pin Circle. Variations AA-AD. Ref. TO-96, TO-97, TO-100.

Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.

Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.

Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.

Registration - J-Lead Ceramic CERQUAD Package Family .050 inch Pitch. Item 11.10-286.

Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch

Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.

Registration - Leadless Flatpack Family, 1.27 mm Terminal Spacing. Item 11.3-055.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.

Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.

Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.

Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.

Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.

Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Metal Enclosure for SSD Devices, E1.S and M.2

Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.

Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.

Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.

Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611

Registration - mSATA SSD Assembly. DIM.

Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.

Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271

Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303.

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

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