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Title	Document #	Date
Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.	MO-278A	Sep 2006
Item 11.14-092 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus.	MO-277A	Sep 2006
Item 11.14-091 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.	MO-205-G	Jul 2006
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.	MO-271-A	Jun 2006
Item 11.11-738 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.	MO-195-D	May 2006
Item 11.11-704 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.	MO-272-A	May 2006
Item 11.11-737 Patents(): STMicroelectronics Inc.: European Patent EP1557881. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.	MO-267-B	Feb 2006
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078	MO-206-E	Jan 2006
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.	MO-265-A	Nov 2005
Item 11.11-722 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.	MO-264-A	Nov 2005
Item 11.4-731 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.	MO-255-B	Oct 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.	MO-263-A	Sep 2005
Item 11.11-734 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.	MO-262-A	Sep 2005
Item 11.11-733 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.	MO-261-A	Jun 2005
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.	MO-257-B	May 2005
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432	MO-156-C	Apr 2005
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.	MO-157-C	Apr 2005
Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 200 pin DDR MiniDIMM. 0.60 mm Lead Centers. Item 11.14-069.	MO-258-A	Dec 2004
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.	MO-211-C	Jun 2004
Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.	MO-251-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.	MO-254-A	Feb 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.	MO-249-A	Jan 2004
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.	MO-250-A	Nov 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.	MO-149-F	Oct 2003
Committee(s): JC-11.11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.	MO-245-A	Sep 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.	MO-241-B	Aug 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.	MO-192-F	Jul 2003
Item 11.11-659 Patents(): National Semiconductor, Citizen Watch Company: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB.	MO-243-A	Jul 2003
Item 11.11-661 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635	MO-238-A	Feb 2003
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611	MO-233-C	Feb 2003
Includes editorial correction of the ball array identification lettering (replace S with T). Item 11.1-652(E). Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423.	MO-235-B	Feb 2003
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 168 pin DIMM. Multiple Keyway Dual-In-Line Memory Module (DIMM), 1.27 mm contact centers. Addition of the 100 pin variation GA-XX and the INACTIVATION of the 168 pin right polarized configuration to DIMM registration. Item 11.14-055/056.	MO-161-F	Dec 2002
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680	MO-239-B	Nov 2002
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049.	MO-214-B	Sep 2002
0.50 mm Lead Centers Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA	MO-158-D	Apr 2002
Patents(): IBM: 4,914,814 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620. This document is being removed based on decission by the Chair under directive from the BoD, letter is attached	MO-220-D	Feb 2002
This registration has been removed. Please 'open file' for more information regarding this issue. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.	MO-208-C	Nov 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.	MO-217-B	Nov 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.	MO-231-A	Aug 2001
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412	MO-232-A	Aug 2001
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.	MO-204-B	Jun 2001
Item 11.11-586 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.	MO-221-C	Jun 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.	MO-228-A	Mar 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline Package with Exposed Heat Sink.	MO-230-A	Mar 2001
Item 11.11-574 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.	MO-226-B	Feb 2001
Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic SOP, 13.30 mm Wide Body, 1.27 mm Pitch, with addition of a 90 lead Small Outline Package as variation CA. Item 11.11-571.	MO-180-B	Feb 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.	MO-190-D	Jan 2001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 232 Pin DDR SDRAM DIMM Family, 1.00 mm Pitch. Item 11.14-042 03/2003	MO-227-A	Nov 2000
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406	MO-169-B	Nov 2000
Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 210 Pin SDRAM Dual-In-Line Memory Module (DIMM) Family, 1.00 mm Contact Centers. Item 11.14-039. This Outline is Now Inactive. Item 11.14-047.	MO-215-A	Nov 2000
Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-024-E.	MO-133-A	Jan 2000
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044. Status: Rescinded	MO-177-A	Jun 1999
Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429. April 2003	MO-201-A	Oct 1997
This outline has been inactivated, please see attachment. The file can be located by going to the JEP95 Main Page, under Microelectronic Outlines, Archives. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA. Status: Elevated to MS-034	MO-151-D	Jun 1997
Item 11.11-555. Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.	MO-147-A	Jul 1994
Item 11.10-321 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Shrink Small Outline Package (SSOP), 5.3 mm Body Width. R-PDSO-G.	MO-150-B	Jan 1994
Item 11.11-366 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.	MO-138-A	Jun 1993
Item 11.10-310 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.	MO-148-A	Jun 1993
Item 11.10-334 Committee(s): JC-11.10, JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.

Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus.

Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.

Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.

Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.

Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078

Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.

Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.

Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.

Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.

Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.

Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.

Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432

Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.

48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.

Registration - 200 pin DDR MiniDIMM. 0.60 mm Lead Centers. Item 11.14-069.

Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.

Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.

Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.

Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.

Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.

Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.

Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.

Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB.

Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635

Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611

Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423.

Registration - 168 pin DIMM. Multiple Keyway Dual-In-Line Memory Module (DIMM), 1.27 mm contact centers. Addition of the 100 pin variation GA-XX and the INACTIVATION of the 168 pin right polarized configuration to DIMM registration. Item 11.14-055/056.

Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680

Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049.

Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Column Grid Array Registration. Item 11.10-415. CBGA-X/CCBA

Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.

Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.

Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.

REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.

Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.

Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.

Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.

Registration - Plastic Small Outline Package with Exposed Heat Sink.

Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.

Registration - Plastic SOP, 13.30 mm Wide Body, 1.27 mm Pitch, with addition of a 90 lead Small Outline Package as variation CA. Item 11.11-571.

Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of optional beveled edge to SODIMM Family. Item 11.14-048.

Registration - 232 Pin DDR SDRAM DIMM Family, 1.00 mm Pitch. Item 11.14-042

Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406

Registration - 210 Pin SDRAM Dual-In-Line Memory Module (DIMM) Family, 1.00 mm Contact Centers. Item 11.14-039. This Outline is Now Inactive. Item 11.14-047.

Replaced - See MS-024-E.

Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.14-044.

Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.

Rescinded - Plastic Ball Grid Array (PBGA) Family 1.0, 1.27, and 1.50 mm Pitch. S-PXGA-X/PBGA.

Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.

Registration - Plastic Shrink Small Outline Package (SSOP), 5.3 mm Body Width. R-PDSO-G.

Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.

Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.

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